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NTHS4501N
Power MOSFET
30 V, 6.7 A, Single N?Channel,
ChipFET t Package
Features
? Planar Technology Device Offers Low R DS(on) and Fast Switching Speed
http://onsemi.com
in a ChipFET Package
? Leadless ChipFET Package has 40% Smaller Footprint than TSOP?6.
Ideal Device for Applications Where Board Space is at a Premium.
? ChipFET Package Exhibits Excellent Thermal Capabilities Where
Heat Transfer is Required.
? Pb?Free Package is Available
Applications
? Buck and Boost Converters
? Optimized for Battery and Load Management Applications in
V (BR)DSS
30 V
R DS(on) Typ
30 m W @ 10 V
40 m W @ 4.5 V
D
I D Max
6.7 A
Portable Equipment such as Notebook Computers, MP3 Players,
Cell Phones, Digital Cameras, Personal Digital Assistants and Other
G
?
Portable Applications
Charge Control in Battery Chargers
S
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
N?Channel MOSFET
Parameter
Symbol
Value
Unit
MARKING DIAGRAM
Drain?to?Source Voltage
Gate?to?Source Voltage
V DSS
V GS
30
± 20
V
V
8
AND PIN ASSIGNMENT
D2 M
G
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Steady
State
t ≤ 5s
Steady
State
t ≤ 5s
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
I D
P D
4.9
3.5
6.7
1.3
0.7
2.5
A
W
1
ChipFET
CASE 1206A
STYLE 1
D2 = Specific Device Code
M = Month Code
1
D D D S
D D D G
Pulsed Drain Current
t p = 10 m s
I DM
20
A
G
= Pb?Free Package
Operating Junction and Storage Temperature
T J ,
T STG
?55 to
150
° C
ORDERING INFORMATION
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
I S
T L
1.1
260
A
° C
Device
Package
Shipping ?
(1/8” from case for 10 s)
THERMAL RESISTANCE RATINGS
NTHS4501NT1
NTHS4501NT1G
ChipFET
ChipFET
(Pb?Free)
3000/Tape & Reel
3000/Tape & Reel
Parameter
Junction?to?Ambient – Steady State (Note 1)
Junction?to?Foot (Drain) Steady State (Note 1)
Junction?to?Ambient – t ≤ 5 s (Note 1)
Symbol
R q JA
R q JF
R q JA
Max
95
20
50
Unit
° C/W
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq. pad size
(Cu area = 1.127 in sq [1 oz] including traces).
? Semiconductor Components Industries, LLC, 2007
February, 2007 ? Rev. 4
1
Publication Order Number:
NTHS4501N/D
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